DocumentCode :
2688106
Title :
Laminar convection behaviour in microchannels in conventional thermal entry length and beyond
Author :
Tso, C.P. ; Mahulikar, S.P.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
fYear :
1998
fDate :
8-10 Dec 1998
Firstpage :
126
Lastpage :
132
Abstract :
Previously reported and present experimental data are processed to give the Nusselt number (Nu) along the flow in microchannels, which is segregated based on the conventional thermal entry length into thermally-developing and thermally-developed modes. The Nu is also found to reduce in the thermally-developed regime, thereby confirming that the unusual behaviour of Nu receding with increasing Reynolds number (Re) is not due to the characteristic of a thermally-developing flow. The experimental data is processed to obtain wall and coolant temperatures along the flow. The differential form of the steady-flow energy equation is derived for heat transfer in microchannels from first principles, which, upon integration, features the dependence of Nu on the Brinkman number (Br)
Keywords :
channel flow; convection; cooling; integration; laminar flow; thermal analysis; thermal management (packaging); Brinkman number; Nusselt number; Reynolds number; coolant temperature; differential steady-flow energy equation; flow segregation; heat transfer; integration; laminar convection behaviour; microchannel flow; microchannels; thermal entry length; thermally-developed modes; thermally-developed regime; thermally-developing flow; thermally-developing modes; wall temperature; Boundary conditions; Coolants; Heat transfer; High speed integrated circuits; Microchannel; Temperature; Thermal conductivity; Very high speed integrated circuits; Very large scale integration; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
Type :
conf
DOI :
10.1109/EPTC.1998.755990
Filename :
755990
Link To Document :
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