Title :
Thermosyphon-cooled bellow liquid heat sink
Author :
Ng, C.Y.R. ; Wong, Y.W. ; Liu, C.Y. ; Choo, K.F.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
A self contained thermosyphon-cooled flexible bellow liquid heat sink was developed for cooling electronic circuit boards. The prototype system combines the benefits of both flexible bellows and thermosyphon technology. A finned flat-plate thermosyphon was designed and tested for natural convection application under various heat source temperatures. Extensive measurements were made on the combined heat sink system comprising the flat-plate thermosyphon and the flexible bellows. Experimental results showed that the dissipation capacity of the prototype liquid heat sink is about 0.006 W/cm2K, which is about six times larger than that using normal convection cooling by the ambient surrounding. The system can maintain the temperature of the heat sources at about 20 K lower that without the application of such a system
Keywords :
cooling; heat sinks; natural convection; printed circuits; thermal management (packaging); ambient surrounding; combined heat sink system; cooling; dissipation capacity; electronic circuit boards; finned flat-plate thermosyphon; flat-plate thermosyphon; flexible bellows; heat source temperature; heat sources; natural convection application; normal convection cooling; prototype liquid heat sink; prototype system; thermosyphon technology; thermosyphon-cooled bellow liquid heat sink; thermosyphon-cooled flexible bellow liquid heat sink; Bellows; Biomembranes; Circuit testing; Electronic circuits; Electronics cooling; Heat sinks; Laboratories; Production engineering; Prototypes; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755993
