• DocumentCode
    2688199
  • Title

    Dynamic phase-frequency characteristic of thermosonic wire bonder transducer

  • Author

    Wang, Fuliang ; Zou, Changhui ; Qiao, Jiaping

  • Author_Institution
    Coll. of Mech. & Electron. Eng., Central South Univ., Changsha
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The resonant frequency of transducer is changed with the state of thermosonic wire bonding interface. The ultrasonic generator need to trace the frequency of transducer, and keep the stimulate frequency consist with the resonant frequency of transducer. The frequency tracking strategy is based on the phase-frequency transducer. The dynamic phase-frequency characteristic was measured with a new FPGA based ultrasonic generator. The dynamic phase-frequency characteristic shows that the stimulation frequency may change by the generator quickly, but the change of phase difference between voltage and current of stimulate electronic signal need 12 ms or much longer time, and the final stable phase is much different with the static phase-frequency characteristic measured by HP4191A. This may be one reason for the phase tracking need 3-5 ms.
  • Keywords
    electronics packaging; field programmable gate arrays; lead bonding; ultrasonic transducers; FPGA based ultrasonic generator; HP4191A; frequency tracking; phase tracking; phase-frequency transducer; thermosonic wire bonder transducer; thermosonic wire bonding interface; time 3 ms to 5 ms; transducer resonant frequency; Bonding; Character generation; Field programmable gate arrays; Phase measurement; Resonant frequency; Signal generators; Ultrasonic transducers; Ultrasonic variables measurement; Voltage; Wire; Thermosonic wire bonding; frequency tracking; phase-frequency characteristic; transducer; ultrasonic generator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607106
  • Filename
    4607106