Title :
Study of prepress force on piezoelectric transducer of wire bonding
Author :
Zhanhui, Li ; Yunxin, Wu ; Zhili, Long
Author_Institution :
Coll. of Mech. & Electron. Eng., Central South Univ., Changsha
Abstract :
The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is reduced. It provides foundation for design and operating of wire bonding system.
Keywords :
lead bonding; piezoelectric transducers; ultrasonic propagation; apply voltage; friction contact model; piezoelectric driver structure; piezoelectric transducer; prepress force; tighten moment; ultrasonic propagation; wire bonding transducer; Bonding forces; Ceramics; Clamps; Packaging; Piezoelectric transducers; Stress; Ultrasonic transducers; Vibrations; Voltage; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607107
