DocumentCode
2688216
Title
Study of prepress force on piezoelectric transducer of wire bonding
Author
Zhanhui, Li ; Yunxin, Wu ; Zhili, Long
Author_Institution
Coll. of Mech. & Electron. Eng., Central South Univ., Changsha
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
3
Abstract
The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is reduced. It provides foundation for design and operating of wire bonding system.
Keywords
lead bonding; piezoelectric transducers; ultrasonic propagation; apply voltage; friction contact model; piezoelectric driver structure; piezoelectric transducer; prepress force; tighten moment; ultrasonic propagation; wire bonding transducer; Bonding forces; Ceramics; Clamps; Packaging; Piezoelectric transducers; Stress; Ultrasonic transducers; Vibrations; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607107
Filename
4607107
Link To Document