DocumentCode :
26883
Title :
Design of Step-Down Broadband and Low-Loss Ruthroff-Type Baluns Using IPD Technology
Author :
Hua-Yen Chung ; Hwann-Kaeo Chiou ; Yuan-Chia Hsu ; Tsung-Yu Yang ; Chia-Long Chang
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Volume :
4
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
967
Lastpage :
974
Abstract :
Ruthroff-type transmission line transformers (TLTs) and baluns prevail over their broadband and low-loss performance. A typical Ruthroff-type balun with a 1:4 step-up impedance transformation ratio was successfully presented using integrated passive devices (IPDs) process. Moreover, two proposed baluns with step-down impedance transformation ratios of 1:1 and 9:4 were developed by modifying the combination of one Ruthroff-type TLT and one Ruthroff-type balun. The two proposed impedance step-down baluns whose balanced impedance is lower than unbalanced impedance make Ruthroff-type balun more flexible for applications; meanwhile, fabricating the baluns using IPD process can help to enhance the low-loss performance. The measured results show that the proposed 1:1 balun exhibits an insertion loss of 0.46 dB with 1-dB fractional bandwidth of 138.9%, and the proposed 9:4 balun exhibits an insertion loss of 0.75 dB with 1-dB fractional bandwidth of 72.4%. The chip areas of the proposed 1:1 and 9:4 baluns, including the pads, are 0.6 and 0.64 mm2, respectively. The two proposed baluns are the first on-chip step-down Ruthroff-type baluns and having an option of center tap, which is highly contributive to wideband and high-efficiency power amplifier design.
Keywords :
baluns; transformers; transmission lines; 1:4 step-up impedance transformation ratio; IPD technology; Ruthroff-type transmission line transformers; TLTs; balanced impedance; first on-chip step-down Ruthroff-type baluns; high-efficiency power amplifier design; impedance step-down baluns; integrated passive device process; loss 0.46 dB; loss 0.75 dB; low-loss Ruthroff-type baluns; low-loss performance; step-down broadband design; unbalanced impedance; wideband power amplifier design; Broadband communication; Impedance; Impedance matching; Insertion loss; Loss measurement; Metals; Power transmission lines; Balun; Ruthroff-type transmission line transformer (TLT) balun; integrated passive devices (IPDs); system-in-a-package (SiP);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2311662
Filename :
6823204
Link To Document :
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