Bonding of gold wire to electrolytic and immersion gold-plated FR-4 laminates at low temperature

Author

Ho, H.M. ; Yeo, C.K. ; Chan, S.L. ; Wong, Nelson ; Ng, C.C. ; Ramanujan, C.S. ; Li, K.

Author_Institution

Delphi Autom. Syst., Singapore

fYear

1998

fDate

8-10 Dec 1998

Firstpage

190

Lastpage

195

Abstract

In this paper, gold ball wire bonding at low temperature using a high frequency transducer was evaluated. The substrates used were FR-4 laminates with two different gold-plated surface finishes: electrolytic and immersion gold-plated. Bonding temperatures of 120°C, 80°C and 40°C were investigated with 1 mil fine pitch gold wire. Prior to wire bonding, the laminates and dice were plasma treated. The surfaces were analyzed prior to and after plasma treatment before wire bonding using XPS and AFM. Bonded areas were also analyzed using SEM. Design of experiment (DOE) techniques have been employed to optimize the bonding parameters at each temperature. The response of the DOE was evaluated by using bond shear and bond pull. The results show that bonding at low temperature is viable with the use of a high frequency transducer wire bonder

Keywords

X-ray photoelectron spectra; adhesion; atomic force microscopy; chip-on-board packaging; design of experiments; electrodeposits; fine-pitch technology; gold; integrated circuit packaging; integrated circuit testing; laminates; lead bonding; mechanical testing; metallisation; optimisation; plasma materials processing; scanning electron microscopy; shear strength; surface treatment; 1 mil; 120 C; 40 C; 80 C; AFM; Au; COB packaging; FR-4 laminates; SEM; XPS; bond pull; bond shear; bonding parameter optimization; bonding temperature; design of experiment techniques; electrolytic gold-plated FR-4 laminates; fine pitch gold wire; gold ball wire bonding; gold wire bonding; gold-plated surface finishes; high frequency transducer; high frequency transducer wire bonder; immersion gold-plated FR-4 laminates; laminates; low temperature bonding; plasma treatment; surface analysis; wire bonding; Bonding; Frequency; Gold; Laminates; Plasma temperature; Surface finishing; Surface treatment; Transducers; US Department of Energy; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.756000

Filename

756000