• DocumentCode
    2688416
  • Title

    Compressible effects in microchannel flows [MEMS]

  • Author

    Fan, Qing ; Xue, Hong

  • Author_Institution
    Dept. of Mech. & Production Eng., Nat. Univ. of Singapore, Singapore
  • fYear
    1998
  • fDate
    8-10 Dec 1998
  • Firstpage
    224
  • Lastpage
    228
  • Abstract
    The direct simulation Monte Carlo (DSMC) method is used for airflow simulation in many micro-electro-mechanical-systems (MEMS). In this application, due to the breakdown of the continuum assumption, traditional methods such as CFD, etc., failed even under standard conditions. However, DSMC is a successful tool when applied to the micro-scale geometry related to MEMS devices. In this paper, simulations of the gaseous flow passing though microchannels in the slip-flow regime are compared with an analytical solution using the Navier-Stokes equations with slip velocity boundary condition. Excellent agreements have been achieved in the fully developed flow region. By way of further investigation, the effects of the pressure ratio are examined. The pressure gradient along the channel direction dominates the flow motion
  • Keywords
    Monte Carlo methods; Navier-Stokes equations; channel flow; cooling; flow simulation; microfluidics; micromechanical devices; thermal management (packaging); CFD; DSMC; DSMC method; MEMS; MEMS devices; Navier-Stokes equations; airflow simulation; channel direction; compressible effects; continuum assumption; direct simulation Monte Carlo method; flow motion; fully developed flow region; gaseous flow simulation; micro-electro-mechanical-systems; micro-scale geometry; microchannel flows; microchannels; pressure gradient; pressure ratio effects; slip velocity boundary condition; slip-flow regime; Analytical models; Boundary conditions; Computational fluid dynamics; Electric breakdown; Geometry; Microchannel; Microelectromechanical devices; Micromechanical devices; Monte Carlo methods; Navier-Stokes equations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
  • Print_ISBN
    0-7803-5141-X
  • Type

    conf

  • DOI
    10.1109/EPTC.1998.756006
  • Filename
    756006