Thermal transient testing of packages without a tester

Thermal transient testing is an excellent method to measure the thermal properties of packages, to check die attach quality and to detect and localise physical defects in the heat removal path. The measured transient responses are also the basis for compact, dynamic thermal model generation. The measurement set-up for the thermal transient experiments is rather complex, including expensive dedicated equipment. The purpose of this paper is to present an alternative solution for thermal transient testing which eliminates the need for expensive hardware. A method for compact thermal model generation is also provided