Scanning acoustic microscope: an attractive tool for the thick film technology characterisation

Author

Krause, J. ; Ousten, Y. ; Fremont, H. ; Danto, Y. ; Schwierzi, B.

Author_Institution

Inst. fuer Halbleitertechnologie und Werkstoffe der Elektrotech., Hannover Univ., Germany

fYear

1990

fDate

0-0 1990

Firstpage

313

Lastpage

321

Abstract

The authors present the physical principles of the scanning acoustic microscope and demonstrate its suitability for the observation of hybrid technology samples. Ink composition, adhesion of the layers, and faults in the substrate, in the bulk, or through serigraphed layers (100 to 1000 MHz) have been successfully investigated. The type of lenses necessary to satisfy the varied needs inherent in hybrid technology are determined.<>

Keywords

acoustic microscopy; hybrid integrated circuits; inspection; nondestructive testing; thick film circuits; 100 MHz to 1 GHz; hybrid technology; ink composition; layer adhesion; operation; scanning acoustic microscope; serigraphed layers; substrate faults; thick film technology characterisation; type of lenses; Acoustic imaging; Acoustic reflection; Acoustic testing; Lenses; Scanning electron microscopy; Surface acoustic waves; Surface impedance; Surface topography; Thick films; Transmission electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171053

Filename

171053