Title :
On the study of the in-use stability of a DCA assembled MEMS device
Author :
Xu, Liyuan ; Song, Jing ; Tang, Jieying
Author_Institution :
Key Lab. of MEMS of Educ. Minist., Southeast Univ., Nanjing
Abstract :
DCA (direct chip attach) is introduced as a main mode for the MEMS (micro-electronics mechanical system) devices packaging. However, thermo-elastic coupling occurred in the DCA package will introduce disturbance stresses and deformations, which may give rise to various packaging effects. In this effort, the in-use structural stability of a packaged MEMS device is further investigated. Susceptibility of a DCA assembled microbridge to in-use stiction with respect to packaging parameters is modeled, estimated and measured.
Keywords :
chip scale packaging; deformation; microassembling; micromechanical devices; thermal management (packaging); thermal stresses; thermoelasticity; DCA assembled microbridge; MEMS device packaging; deformation; direct chip attach package; disturbance stresses; in-use structural stability; microelectronics mechanical system; thermo-elastic coupling; Adhesives; Assembly; Capacitive sensors; Costs; Microelectromechanical devices; Micromechanical devices; Packaging; Stability; Structural engineering; Thermal stresses; DCA; MEMS package; in-use stability; peel number; strain distribution;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607123
