Title :
The effect of reflow condition on the characteristics of PBGA solder joint
Author :
Fan, S.H. ; Chan, Y.C. ; Zou, X.C. ; Yu, Z.Q.
Author_Institution :
Dept. of Electron. Eng., Hong Kong City Univ., Kowloon, Hong Kong
Abstract :
The shear strength (shear break force) of a plastic ball grid array (PBGA) assembly solder joint formed under different reflow profiles is investigated in this paper. It is found that the preheat time of the reflow profile has a great effect on the PBGA solder joint shear strength, and the best preheat time to achieve the maximum solder joint shear strength is close to 120 s. The PBGA solder joint geometry formed under different reflow preheat times is also therefore scrutinized. The preheat time has a crucial effect on the PBGA solder joint geometry. Since the break usually occurs at the weakest point of the solder joint, the solder joint geometry has a close relationship with its shear strength. The resistance of the PBGA daisy chains (solder joints) is also inspected in this paper. The result shows that the smaller the resistance, the greater the shear strength. This is the first time that the relationship between the solder joint shear strength and its resistance has been revealed
Keywords :
ball grid arrays; electric resistance; fracture; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; plastic packaging; shear strength; soldering; temperature distribution; thermal analysis; 120 s; PBGA assembly solder joint; PBGA daisy chains; PBGA solder joint characteristics; PBGA solder joint geometry; PBGA solder joint shear strength; plastic ball grid array; preheat time; reflow condition effects; reflow preheat time; reflow profiles; resistance; shear break force; shear strength; solder joint breakage; solder joint geometry; solder joint shear strength; Assembly; Capacitive sensors; Electronics packaging; Failure analysis; Fatigue; Geometry; Lead; Plastics; Soldering; Surface-mount technology;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.756013
