Title :
Measurement on thermal properties of solid films in electronic packages
Author :
Shi, X.Q. ; Pang, H.L.J. ; Zhou, W. ; Yang, Q.J.
Author_Institution :
Gintic Inst. of Manuf. Technol., Singapore
Abstract :
A real-time holographic interferometry computer-aided-measurement system for measurement of the thermal properties of solid films has been established. The two principal problems of heat loss and edge reflection and their effects on measurement accuracy were analysed. With this new method, films commonly used in electronic packages, such as aluminium, copper, silicon, nickel, molybdenum, 63Sn/37Pb solder alloy, and FR-4, with various coefficients of thermal expansion ranging from 2.5 ppm/°C to 25 ppm/°C and thermal conductivities ranging from 0.2 W/m-K to 380 W/m-K, were measured. The experimental results show that this system has a high measurement accuracy and a wide measurement range for both coefficient of thermal expansion and thermal conductivity
Keywords :
assembling; dielectric thin films; holographic interferometry; integrated circuit measurement; integrated circuit metallisation; integrated circuit packaging; metallic thin films; printed circuits; semiconductor thin films; soldering; thermal conductivity measurement; thermal expansion measurement; Al; Cu; FR-4 film; Mo; Ni; Si; SnPb; SnPb solder alloy; aluminium film; coefficient of thermal expansion; copper film; edge reflection; electronic package films; electronic packages; heat loss; measurement accuracy; measurement range; microelectronic packaging; molybdenum film; nickel film; real-time holographic interferometry computer-aided-measurement system; silicon film; solid films; thermal conductivity; thermal properties; thermal properties measurement; Conductivity measurement; Electronic packaging thermal management; Holography; Interferometry; Optical films; Real time systems; Reflection; Solids; Thermal conductivity; Thermal expansion;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.756021
