Title :
Effect of stand-off height on the microstructure and fracture mode of Cu/Sn-9Zn/Cu solder joint under tensile test
Author :
Bo Wang ; Wu, Fengshun ; Bin Du ; Bing An ; Yiping Wu
Author_Institution :
Dept. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
This study investigates the effect of the stand-off height (SOH) on the microstructure and tensile fracture mode of Cu/Sn9Zn/Cu solder joints. Solder joints with SOH of 100 mum, 50 mum and 20 mum are studied. It is found that as the SOH is reduced, Zn content has a rapid decrease in the solder bulk, while, the intermetallic compound (IMC) layer proportion increases. SOH of the solder joint also has an important effect on the tensile strength and tensile fracture mode. Tensile strength of solder joints decreases with lower SOH, which correlates with the change of microstructure and composition in solder joint. When the SOH is reduced, the fracture path of solder joint transfers from the bulk of the solder joint into the IMC/solder interface, and the fracture mode tends to transform from ductile fracture into brittle fracture.
Keywords :
copper alloys; fracture toughness testing; solders; tensile testing; tin alloys; zinc alloys; Cu-Sn-Zn-Cu; brittle fracture; ductile fracture; intermetallic compound layer; size 100 mum; size 20 mum; size 50 mum; solder joint; stand-off height; tensile test; Bars; Electronics packaging; Failure analysis; Intermetallic; Manufacturing; Mechanical factors; Microstructure; Soldering; Testing; Wafer scale integration; fracture mode; microstructure; stand-off height (SOH); tensile test;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607135
