Title :
Effect of mold resin on reliability in gold-aluminum bonding
Author :
Imasato, E. ; Araki, M. ; Shimizu, Isao ; Ohno, Y.
Author_Institution :
Dept. of Mater. Sci., Kumamoto Univ., Japan
Abstract :
Gold-aluminum wire bonds in LSI is drastically degraded by corrosion of the Au-Al intermetallic compound. This corrosion is due to bromine gas that is emitted when the encapsulant resin is exposed to a high temperature. In this study, temperature dependence of this bond degradation was investigated. Degradation starting times of Au-Al compounds as a function of annealing temperatures ranging from 180 to 280°C were studied. The higher the annealing temperature was, the faster shear strength was degraded. Activation energy of this degradation behaviour was calculated to be 110 kJ/mol, which was similar to that of Au-Al intermetallic layer growth. It was found that intermetallic compounds formed with an Au-Al bond by high temperature annealing were corroded by bromine gas at room temperature
Keywords :
aluminium; annealing; corrosion; encapsulation; gold; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; large scale integration; lead bonding; moulding; shear strength; 180 to 280 C; Au-Al; Au-Al bond; Au-Al compounds; Au-Al intermetallic compound; Au-Al intermetallic layer growth; AuAl; LSI; activation energy; annealing temperature; bond degradation; bond degradation starting times; bromine gas; bromine gas corrosion; corrosion; encapsulant resin; gold-aluminum bonding; gold-aluminum wire bonds; high temperature annealing; intermetallic compounds; mold resin; reliability; shear strength; temperature dependence; Annealing; Bonding; Corrosion; Degradation; Intermetallic; Large scale integration; Resins; Temperature dependence; Temperature distribution; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.756026
