Calculation of deflection and mechanical stresses in plates of the rectangular form by variational and numerical methods [for pressure sensor design]

Author

Gridchin, Victor A. ; Shaporin, Alexey V.

Author_Institution

Dept. of Semicond. Devices & Microelectron., Novosibirsk State Tech. Univ., Russia

fYear

2000

fDate

2000

Firstpage

111

Lastpage

118

Abstract

The influence of tensile and compressive in-plane stresses of silicon plates are investigated. The cases of square and rectangular shaped elastic elements are considered. It is shown that in-plane stresses can have a great influence on plate deflection and stress distribution, and should be taken into account when designing piezoresistive pressure sensors

Keywords

Galerkin method; bending; boundary-value problems; elemental semiconductors; finite element analysis; internal stresses; microsensors; piezoresistive devices; pressure sensors; silicon; stress analysis; BVP; FEM; Galerkin-Ritz method; Si; compression in-plane stresses; deflection; mechanical stresses; piezoresistive pressure sensors; planar elastic element; rectangular plates; stress distributions; tensile in-plane stresses; variational calculation; Capacitive sensors; Finite difference methods; Lattices; Mechanical sensors; Microelectronics; Moment methods; Piezoresistance; Semiconductor devices; Silicon; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices and Materials, 2000. EDM 2000. Siberian Russian Student Workshops on

Conference_Location

Novosibirsk

Print_ISBN

5-7782-0291-1

Type

conf

DOI

10.1109/SREDM.2000.888587

Filename

888587