Title :
Surface mount technology in communications products
Author :
Walker, Mauro J.
Abstract :
Summary form only given. Motorola development efforts in the area of communications-product surface-mount assembly are discussed. Attention is given to the development of a single-layer metallized chip carrier technology which has resulted in high-density packaging of integrated circuits with no compromise of field reliability or environmental performance. Techniques for the attachment or surface mount of these and other components directly to printed circuit boards are also examined.<>
Keywords :
design engineering; printed circuit manufacture; reliability; surface mount technology; Motorola; SMT; communications products; environmental performance; field reliability; high-density packaging; printed circuit boards; single-layer metallized chip carrier technology; surface-mount assembly; Costs; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Multichip modules; Packaging machines; Paper technology; Robotic assembly; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171058
