Solder pastes tackiness: the influences of the process atmosphere and of the test method

Author

Guillaume, Boissonnat ; Guinet, J. ; Hubert, Jean-Claude

Author_Institution

Telemecanique, Nanterre, France

fYear

1990

fDate

0-0 1990

Firstpage

375

Lastpage

384

Abstract

During the assembly of surface-mounted devices, a storage time may exist between screen printing and infrared reflow. For this reason, solder pastes have been characterized by their tackiness. Results given by two methods of tackiness measurement are presented in order to choose the more appropriate method for the present application. Tackiness evolution was observed during the storage of screen-printed circuits for different atmospheric compositions. A correlation between the pastes´ tackiness and the intrinsic characteristics of their vehicles has been established. It is shown that the tack time is improved by storage of the screen-printed circuits in a dry atmosphere.<>

Keywords

printed circuit manufacture; soldering; surface mount technology; assembly of surface-mounted devices; atmospheric compositions; dry atmosphere; infrared reflow; process atmosphere; process optimisation; screen printing; solder pastes; storage of screen-printed circuits; storage time; tack time; tackiness measurement; test method; Assembly; Atmosphere; Atmospheric measurements; Circuit testing; Humidity; Nitrogen; Printed circuits; Qualifications; Solvents; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171060

Filename

171060