The new soldering process (´clean soldering´ with residueless flux)

Author

Kawakatsu, Ichiro ; Yokoi, Kazuo

Author_Institution

Riverbond Res. Inst., Tokyo, Japan

fYear

1990

fDate

0-0 1990

Firstpage

368

Lastpage

374

Abstract

A novel soldering process named ´clean soldering´ is described. It is a soldering process in an inert gas atmosphere with a specially composed residueless flux. This process does not require any washing and cleaning operation. It is suggested that it will contribute to the solution of the pollution problem of organic solvents. The products manufactured by this soldering process have sufficient insulation resistance, are suitable for high-density PCBAs (SMT), reduce the defects in soldered joints, prevent oxidation of solder baths, and are safe for the human body.<>

Keywords

printed circuit manufacture; reliability; soldering; surface mount technology; SMT; clean soldering; defect reduction; eliminates organic solvents; high density PCBs; high-density PCBAs; inert gas atmosphere; insulation resistance; no cleaning operation; prevent oxidation of solder baths; residueless flux; safe; soldering process; Atmosphere; Cleaning; Environmentally friendly manufacturing techniques; Immune system; Insulation; Manufacturing processes; Pollution; Soldering; Solvents; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171061

Filename

171061