• DocumentCode
    2690166
  • Title

    Research on the Returns Policy Model of a Dual-Channel Supply Chain in E-commerce

  • Author

    Lei, Cao ; Zigang, Zhang ; Kaijun, Liu

  • Author_Institution
    Coll. of Manage., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2009
  • fDate
    16-17 May 2009
  • Firstpage
    21
  • Lastpage
    25
  • Abstract
    This paper quantitatively analyzes the use of the e-marketplace for selling the returned products after rework in a dual-channel supply chain. In our dual-channel model, we derive the optimal order quantities and optimal retail prices for all the parties in the supply chain and we also propose the optimal buyback price established by the manufacturer. Through comparative analysis of the single-channel and the dual-channel model, we further find that the returns policy with e-marketplace is better than the traditional returns policy. In e-commerce, due to the existence of B2B e-marketplace, the returned products can be sold with a higher price which is higher than the salvage price. Both the manufacturer and the retailer can benefit from the dual-channel supply chain. Finally, we show that the retailerpsilas expected profit is an increasing function of the buyback price and the manufacturerpsilas expected profit is a decreasing function of the buyback price.
  • Keywords
    electronic commerce; pricing; supply chain management; comparative analysis; dual-channel supply chain in e-commerce; e-marketplace; optimal buyback price; optimal order quantities; optimal retail prices; returns policy model; Consumer electronics; Educational institutions; Electronic commerce; Engineering management; Information analysis; Paper technology; Supply chain management; Supply chains; Technology management; Virtual manufacturing; channel conflict; dual-channel; e-commerce; e-marketplace; returns policy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Engineering and Electronic Commerce, 2009. IEEC '09. International Symposium on
  • Conference_Location
    Ternopil
  • Print_ISBN
    978-0-7695-3686-6
  • Type

    conf

  • DOI
    10.1109/IEEC.2009.11
  • Filename
    5175067