Title :
COB and SMD on FR4 and flex PWB (printed wired board) for miniaturized modules
Author_Institution :
Valtronic SA, Les Charbonnieres, Switzerland
Abstract :
The authors describe an original mode of packaging using COB (chip-on-board) and SMD (surface-mount-devices) technology for many electronic applications when miniaturization and low weight are conditions. Attention is given to the wiring principle, the construction, the components, and the assembly.<>
Keywords :
modules; packaging; printed circuit design; printed circuit manufacture; surface mount technology; COB; FR4; SMD; assembly; chip-on-board; components; construction; flex PWB; low weight; miniaturization; miniaturized modules; mode of packaging; printed wired board; surface-mount-devices; wiring principle; Application software; Assembly; Bonding; Electronics packaging; Mechanical variables measurement; Portable computers; Semiconductor device measurement; Telecommunication computing; Watches; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171067
