Title :
A spectral integral method for layered media
Author :
Simsek, Ergun ; Liu, Jianguo ; Liu, Qing Huo
Author_Institution :
Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Abstract :
Summary form only given. In order to solve layered-medium problems, various numerical methods have been developed. We are concerned with piecewise homogeneous objects embedded in a layered medium. As such; the surface integral equation (SIE) can be used to reduce the number of unknowns compared with the volume integral equation. The SIE is solved first with the method of moments (MoM) and then with the fast multipole method (FMM) to calculate the electromagnetic fields scattered from a homogeneous scatter with arbitrary geometry in free space. J. Liu and Q. H. Liu (see IEEE Micro. and Wire. Comp. Lett., vol.14, no.3, p.97-9, 2004) developed a spectral integral method (SIM) as an alternative way of solving the surface integral equation more efficiently than MoM for arbitrarily-shaped smooth dielectric cylinders in free space. We extend this method to arbitrarily-shaped smooth perfect electrical conductor (PEC) and dielectric cylinders in a multilayer medium. We have demonstrated the spectral accuracy of the method and the reduced computational cost from that of the MoM. This method can also be extended to three dimensions.
Keywords :
conducting bodies; dielectric bodies; electromagnetic wave scattering; inhomogeneous media; integral equations; method of moments; MoM; arbitrarily-shaped smooth dielectric cylinders; arbitrarily-shaped smooth perfect electrical conductor cylinders; computational cost; electromagnetic field scattering; fast multipole method; layered media; method of moments; piecewise homogeneous objects; spectral integral method; surface integral equation; volume integral equation; Computational efficiency; Conductors; Dielectrics; Electromagnetic fields; Electromagnetic scattering; Geometry; Integral equations; Moment methods; Nonhomogeneous media; Wire;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Print_ISBN :
0-7803-8883-6
DOI :
10.1109/APS.2005.1552481