• DocumentCode
    2690883
  • Title

    Study of electron and hole injection statistics of BE-SONOS NAND Flash

  • Author

    Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Lai, Sheng-Chih ; Chen, Y.J. ; Chen, K.F. ; Lo, Chester ; Huang, I.J. ; Han, T.T. ; Chen, M.S. ; Lu, W.P. ; Chen, K.C. ; Chang, C.S. ; Liaw, M.H. ; Hsieh, Kuang-Yeu ; Lu, Chih-Yuan

  • Author_Institution
    Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    16-19 May 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The electron and hole injection statistics of BE-SONOS NAND Flash is studied for the first time using a 75 nm charge-trapping NAND Flash test chip. By using the incremental step pulse programming (ISPP) method the impact of device variations are minimized and the electron number (N) fluctuation can be identified. We find that both electron and hole injection statistics well follow the Poisson statistics (Sigma ∝ √N, where Sigma corresponds to the distribution width). However, due to the 3D fringing field effect the small transistors require more charge injection to obtain the same memory window, and this reduces the proportional factor of Sigma. We also found that the hole injection distribution is slightly broader than the electron injection, and can be explained by the lower charge centroid in nitride which leads to the larger proportional factor. Based on these results, we can also simulate the distribution for various technology nodes.
  • Keywords
    Poisson distribution; flash memories; 3D fringing field effect; BE-SONOS NAND flash; Poisson statistics; electron injection statistics; electron number fluctuation; hole injection statistics; incremental step pulse programming; Charge carrier processes; Electrons; Fluctuations; Gaussian distribution; Reliability engineering; Statistical analysis; Statistical distributions; Statistics; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2010 IEEE International
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-6719-8
  • Electronic_ISBN
    978-1-4244-7668-8
  • Type

    conf

  • DOI
    10.1109/IMW.2010.5488308
  • Filename
    5488308