DocumentCode
2690976
Title
Improved resistive switching memory characteristics using novel bi-layered Ge0.2 Se0.8 /Ta2 O5 solid-electrolytes
Author
Rahaman, S.Z. ; Maikap, S.
Author_Institution
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
fYear
2010
fDate
16-19 May 2010
Firstpage
1
Lastpage
4
Abstract
Novel bi-layered solid electrolytic based resistive switching memory device using Al/Cu/Ge0.2Se0.8/Ta2O5/W structure has been investigated for the first time. The tight distribution of resistance states and threshold voltage are achieved as compared to that of single layer Ge0.2Se0.8 solid-electrolyte. Stable endurance of ≫3.5×105 cycles and excellent retention characteristics with a low compliance current of 100 nA are obtained at 85°C. The high resistance state (RHigh) increases with decreasing the device size from 8 μm to 0.2 μm. The low resistance state (RLow) is independent with different via diameters. The RLow decreases with increasing the compliance currents from 1nA to 1mA, which can be useful for future nanoscale low power consuming nonvolatile memory device applications.
Keywords
electrolytes; integrated memory circuits; Ge0.2Se0.8-Ta2O5; bilayered solid electrolytic based resistive switching memory device; high resistance state; nanoscale low power consuming nonvolatile memory device; resistance states; resistive switching memory characteristics; threshold voltage; Copper; Delay; Electrons; Etching; Hysteresis; Lithography; Nanoscale devices; Nonvolatile memory; Solid state circuits; Threshold voltage; Cu filament; GeSe; bi-layered solid-electrolyte; high-к Ta2 O5 ; nanoscale memory; resistive switching;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2010 IEEE International
Conference_Location
Seoul
Print_ISBN
978-1-4244-6719-8
Electronic_ISBN
978-1-4244-7668-8
Type
conf
DOI
10.1109/IMW.2010.5488314
Filename
5488314
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