• DocumentCode
    2690976
  • Title

    Improved resistive switching memory characteristics using novel bi-layered Ge0.2Se0.8/Ta2O5 solid-electrolytes

  • Author

    Rahaman, S.Z. ; Maikap, S.

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • fYear
    2010
  • fDate
    16-19 May 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Novel bi-layered solid electrolytic based resistive switching memory device using Al/Cu/Ge0.2Se0.8/Ta2O5/W structure has been investigated for the first time. The tight distribution of resistance states and threshold voltage are achieved as compared to that of single layer Ge0.2Se0.8 solid-electrolyte. Stable endurance of ≫3.5×105 cycles and excellent retention characteristics with a low compliance current of 100 nA are obtained at 85°C. The high resistance state (RHigh) increases with decreasing the device size from 8 μm to 0.2 μm. The low resistance state (RLow) is independent with different via diameters. The RLow decreases with increasing the compliance currents from 1nA to 1mA, which can be useful for future nanoscale low power consuming nonvolatile memory device applications.
  • Keywords
    electrolytes; integrated memory circuits; Ge0.2Se0.8-Ta2O5; bilayered solid electrolytic based resistive switching memory device; high resistance state; nanoscale low power consuming nonvolatile memory device; resistance states; resistive switching memory characteristics; threshold voltage; Copper; Delay; Electrons; Etching; Hysteresis; Lithography; Nanoscale devices; Nonvolatile memory; Solid state circuits; Threshold voltage; Cu filament; GeSe; bi-layered solid-electrolyte; high-к Ta2O5; nanoscale memory; resistive switching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2010 IEEE International
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-6719-8
  • Electronic_ISBN
    978-1-4244-7668-8
  • Type

    conf

  • DOI
    10.1109/IMW.2010.5488314
  • Filename
    5488314