DocumentCode
2691650
Title
A 3-Stage Pipelined Large Integer Modular Arithmetic Unit for ECC
Author
Duan Cheng-hua ; Liu Yi ; Chen Yong-tao
Author_Institution
Sch. of Inf. Sci. & Eng., Grad. Univ. of Chinese Acad. of Sci., Beijing, China
fYear
2009
fDate
16-17 May 2009
Firstpage
519
Lastpage
523
Abstract
Large integer modular multiplication and modular addition/subtraction are basic operations in elliptic curve cryptography (ECC). Traditionally, systolic array was used to implement modular multiplication. It is not efficient because of data dependency between neighbor processing elements (PEs). In this paper, we propose a compact modular multiplication and addition unit (MMAU) specific for ECC by dividing an improved Montgomery modular multiplication (MMM) algorithm into three parts, mapping them correspondingly to a 3-stage pipelined circuit and adding a small amount of hardware to the third stage of the pipeline for implementing modular addition/subtraction without affecting the performance of MMM. The MMAU computes one modular multiplication and one modular addition/subtraction in every 3(n+7) clock cycles for n-bit operands. When the pipeline is fully utilized, the MMAU can generate a result at every n+7 cycles. The experimental results show that our scheme achieves a higher throughput with less resource compared with existed ones.
Keywords
pipeline arithmetic; public key cryptography; 3-stage pipelined circuit; Montgomery modular multiplication algorithm; elliptic curve cryptography; integer modular multiplication; modular addition; modular multiplication and addition unit; modular subtraction; processing element; systolic array; Adders; Arithmetic; Circuits; Elliptic curve cryptography; Elliptic curves; Hardware; Pipeline processing; Public key cryptography; Systolic arrays; Throughput; Montgomery algorithm; Symmetric elliptic curve cryptography (ECC); modular addition/subtractionIntroduction; pipelining technique;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Engineering and Electronic Commerce, 2009. IEEC '09. International Symposium on
Conference_Location
Ternopil
Print_ISBN
978-0-7695-3686-6
Type
conf
DOI
10.1109/IEEC.2009.115
Filename
5175172
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