Title :
8th IEMT 1990. International Electronic Manufacturing Technology Symposium (Cat. No.90CH2833-2)
Abstract :
The following topics are dealt with: multichip modules; manufacturing technology; substrates and packages, design, quality and reliability; surface mount technology; thick and thin film; and applications and packaging
Keywords :
design engineering; electronic equipment manufacture; hybrid integrated circuits; integrated circuit manufacture; modules; packaging; printed circuits; quality control; reliability; substrates; surface mount technology; thick film circuits; thin film circuits; design; manufacturing technology; multichip modules; packages; packaging; quality; reliability; substrates; surface mount technology; thick films; thin film;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171075
