DocumentCode :
2692143
Title :
Scalability enhancement of FG NAND by FG shape modification
Author :
Ganguly, Udayan ; Yokota, Yoshitaka ; Tang, Jing ; Sun, Shiyu ; Rogers, Matt ; Jin, Miao ; Thadani, Kiran ; Hamana, Hiroshi ; Leung, Garlen ; Chandrasekaran, Balaji ; Thirupapuliyur, Sunderraj ; Olsen, Chris ; Nguyen, Vicky ; Srinivasan, Swami
Author_Institution :
Silicon Syst. Group, Appl. Mater. Inc., Sunnyvale, CA, USA
fYear :
2010
fDate :
16-19 May 2010
Firstpage :
1
Lastpage :
4
Abstract :
Floating Gate (FG) NAND scaling has been severely challenged by the reduction of gate coupling ratio (CR) and increase in FG interference (FGI) below 30nm node. Firstly, scalability of inverted "T" shaped FG is evaluated by 3D electrostatics simulation. It is shown that coupling ratio (CR) and Floating Gate Interference (FGI) performance can be maintained at the level of 34nm technology down to 13nm node by engineering key aspects of the FG shape namely FG top width (FGW) and effective field height (EFH) in addition to conventional scaling approaches of IPD thinning and spacer k reduction. Secondly, FG shaping is demonstrated down to FGW of 3nm and EFH of 5nm using a sacrificial oxidation technology with no bird\´s beak to demonstrate fabrication feasibility.
Keywords :
NAND circuits; electrostatics; 3D electrostatics simulation; FG NAND scaling; FG shape modification; FG top width; IPD thinning; effective field height; floating gate interference; gate coupling ratio; oxidation technology; scalability enhancement; size 13 nm; size 34 nm; spacer k reduction; Capacitance; Character generation; Chromium; Electrostatics; High K dielectric materials; High-K gate dielectrics; Interference; Scalability; Shape; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2010 IEEE International
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-6719-8
Electronic_ISBN :
978-1-4244-7668-8
Type :
conf
DOI :
10.1109/IMW.2010.5488389
Filename :
5488389
Link To Document :
بازگشت