DocumentCode
2692284
Title
A Study Of Polyimide Adhesion To Epoxy Resjn In PFP Using Multivariate Analysis Of XPS Spectra
Author
Takeuchi, Koichi ; Tsutsui, Kaganori ; Miura, Nobuhito
fYear
1993
fDate
9-11 Jun 1993
Firstpage
9
Lastpage
12
Keywords
Adhesives; Chemical analysis; Coatings; Epoxy resins; Nitrogen; Performance analysis; Plasma applications; Polyimides; Semiconductor device packaging; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639283
Filename
639283
Link To Document