Title :
Planarization Process Of Copper-polyimide Thin Film Multilayer Substrate
Author :
Kasuya, Yukio ; Takahashi, Y. ; Uno, Yutakn ; Iguchi, Yoshinori ; Kanamori, Toshiyuki
Keywords :
Circuit testing; Dielectric substrates; Dielectric thin films; Etching; Integrated circuit interconnections; Nonhomogeneous media; Planarization; Polyimides; Resists; Transistors;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639284
