Title :
Towards Low Cost High Density Bumping
Author :
Aintila, Ahti ; Järvinen, Eero ; Lalu, Sinikka
Keywords :
Adhesives; Aluminum; Assembly; Bonding; Costs; Gold; Nickel; Passivation; Printed circuits; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639289
