DocumentCode :
26929
Title :
A Method to Prevent Strong Snapback in LDNMOS for ESD Protection
Author :
Hang Fan ; Lingli Jiang ; Bo Zhang
Author_Institution :
Sch. of Microelectron. & Solid-States Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume :
13
Issue :
1
fYear :
2013
fDate :
Mar-13
Firstpage :
50
Lastpage :
53
Abstract :
High injection electron current in an LDNMOS can lead to a strong snapback and latch-up-like characteristic. It is susceptible to latch-up-like in high-voltage ICs, if its holding voltage is lower than the power supply voltage. A method to raise the LDNMOS holding voltage is proposed and verified in a 0.35-μm 20-V/5-V BCD process without additional masks. It is realized by adding a relative high doping Nw provided for a 5-V PMOS in the drain region. The doping concentration in the Nw is higher than the injection electron density from the source under ESD stress. The Nw can extend the length of the space-charge region and lead to a higher voltage drop and high strong snapback current. This way, we get an LDNMOS with holding voltage higher than 24 V.
Keywords :
BIMOS integrated circuits; doping profiles; electrostatic discharge; space charge; BCD process; ESD protection; LDNMOS holding voltage; PMOS; doping concentration; drain region; high injection electron current; high-voltage integrated circuit; latch-up-like characteristic; size 0.35 mum; space-charge region; strong snapback current; strong snapback prevention; voltage 20 V; voltage 5 V; voltage drop; Doping; Electric fields; Electrostatic discharges; Robustness; Space charge; Stress; Transistors; ESD; LDNMOS; high holding voltage;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2012.2210043
Filename :
6248198
Link To Document :
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