• DocumentCode
    2693061
  • Title

    High electron mobility germanium MOSFETs: Effect of n-type channel implants and ozone surface passivation

  • Author

    Hennessy, J. ; Antoniadis, D.A.

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2009
  • fDate
    22-24 June 2009
  • Firstpage
    257
  • Lastpage
    258
  • Abstract
    Germanium n-channel devices have historically shown poor performance due to an asy mmetric distribution of interface st ates that degrade electrostatic behavior and carrier mobility. In this study we demonstrate two methods for improving the performance of Ge nFETs, ozone surface passivation and ntype ion-implantation. Surface-channel nMOSFETs receiving a combination of O3 passivation and 1*1012 dose As or Sb implants show mobility comparable to the highest reported to date with improved subthreshold slope. Devices showing buried-channel characteristics show even higher peak mobility (higher than Si at low in version densities) illustrating that interface states are still limiting electron mobility in surface-channel Ge devices.
  • Keywords
    MOSFET; carrier mobility; germanium; high electron mobility transistors; passivation; Ge; buried-channel characteristics; carrier mobility; electrostatic behavior; high electron mobility germanium MOSFET; limiting electron mobility; n-channel devices; n-type channel implant effect; nFET; ozone surface passivation; Aluminum oxide; Charge carrier processes; Electron mobility; Germanium; Implants; MOSFETs; Passivation; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2009. DRC 2009
  • Conference_Location
    University Park, PA
  • Print_ISBN
    978-1-4244-3528-9
  • Electronic_ISBN
    978-1-4244-3527-2
  • Type

    conf

  • DOI
    10.1109/DRC.2009.5354921
  • Filename
    5354921