DocumentCode
2693279
Title
Dielectric and Temperature Measurements During Microwave Curing of Epoxy in a Sweeping Resonant Cavity
Author
Jow, J. ; Finzel, M. ; Asmussen, J. ; Hawley, M.C.
Volume
1
fYear
1987
fDate
May 9 1975-June 11 1987
Firstpage
465
Lastpage
468
Abstract
A TM/sub 012/ -mode cylindrical cavity was mechanically critically couple with a microwave circuit at 3.2 GHz. A fluoroptic temperature sensing device was used to monitor temperature in the microwave environment. Stoichiometric mixtures of epoxy (DER 332) and amine (DDS) were heated in this sweeping resonant cavity for curing times of 10 and 30 minutes, respectively. On-line temperature and dielectric properties versus time profiles were measured during the curing process. The dielectric properties versus temperature also measured during cooling. Thereafter, extent of cure of epoxy was determined Differential Scanning Calorimeter.
Keywords
Coupling circuits; Curing; Density estimation robust algorithm; Dielectric measurements; Electromagnetic heating; Microwave circuits; Microwave devices; Resonance; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1987 IEEE MTT-S International
Conference_Location
Palo Alto, CA, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1987.1132433
Filename
1132433
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