DocumentCode :
2693322
Title :
Low-voltage metal-gate top-contact organic thin-film transistors and complementary inverters with submicron channel length
Author :
Ante, F. ; Zschieschang, U. ; Weitz, R.T. ; Kalblein, D. ; Kern, K. ; Klauk, H.
Author_Institution :
Max Planck Inst. for Solid State Res., Stuttgart, Germany
fYear :
2009
fDate :
22-24 June 2009
Firstpage :
179
Lastpage :
180
Abstract :
Since the mobility of organic semiconductors cannot be increased indefinitely , improvements in the dynamic performance of organic thin-film transistors (TFTs) require reductions in the TFT dimensions. Assuming a mobility of 0.1 cm2/Vs and aiming for a cutoff frequency of 10 MHz at 3 V, channel length and gate-to-contact overlap have to be reduced well below 1 ¿m. Although no cost-effective methods to manufacture high-mobility submicron organic TFTs on large-area flexible substrates currently exist, such methods may become available in the near future. To ensure that the carrier density in short-channel TFTs is controlled by the gate, rather than the drain, the gate dielectric thickness must also be reduced, ideally using a low-temperature-processable dielectric and without introducing large gate leakage.
Keywords :
organic semiconductors; thin film transistors; carrier density; complementary inverters; gate dielectric thickness; gate-to-contact overlap; high-mobility submicron organic TFT; large gate leakage; low-temperature-processable dielectric; metal-gate top-contact organic thin film transistors; organic semiconductors; submicron channel length; Charge carrier density; Cutoff frequency; Dielectric substrates; Flexible manufacturing systems; Gate leakage; Inverters; Organic semiconductors; Organic thin film transistors; Thickness control; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2009. DRC 2009
Conference_Location :
University Park, PA
Print_ISBN :
978-1-4244-3528-9
Electronic_ISBN :
978-1-4244-3527-2
Type :
conf
DOI :
10.1109/DRC.2009.5354939
Filename :
5354939
Link To Document :
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