Title :
Reduction in ohmic loss of small microstrip antennas using multiple copper layers
Author :
Latif, Saeed I. ; Shafai, C. ; Shafai, Lotfollah
Author_Institution :
Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man.
Abstract :
In this paper, the simulation results of multi-layered miniaturized microstrip antennas were presented. The gain was increased and the method shows a great promise for directivity enhancement of the small antennas, by reducing the resistive losses in stacked multiple thin copper layers. Using the available microfabrication laboratory, multi-layered compact antennas are now being fabricated, and the test results were presented during the symposium. Silicon, or other dielectric, can be used as laminating material, instead of the air gap, in the practical fabrication process
Keywords :
laminates; microstrip antennas; silicon; directivity enhancement; microfabrication laboratory; multi-layered compact antennas; multi-layered miniaturized microstrip antennas; multiple copper layers; ohmic loss reduction; practical fabrication process; silicon laminating material; small microstrip antennas; stacked multiple thin copper layers; Antenna accessories; Coaxial cables; Conductors; Copper; Electronic components; Microstrip antennas; Patch antennas; Propagation losses; Skin; Solids;
Conference_Titel :
Antennas and Propagation Society International Symposium 2006, IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
1-4244-0123-2
DOI :
10.1109/APS.2006.1710870