DocumentCode
2693697
Title
Cooling system transient analysis using an electric circuit program analog
Author
Loughlin, J.O. ; Loree, D.
Author_Institution
Air Force Res. Lab., Kirtland AFB, NM, USA
Volume
2
fYear
2003
fDate
15-18 June 2003
Firstpage
767
Abstract
By exploiting the common mathematical similarities between electrical and thermal circuits, an electric circuit transient analysis program may be used to analyze the transient behavior of thermal circuits. This is an especially convenient approach for the analysis and optimization of the cooling performance of burst mode type electrical apparatus such as high power transmitters. The relations between electrical components and the equivalent thermal components are established such that given the thermal component characteristics, one may then write and electric circuit with the proper values and then run the model to determine the performance in electrical parameters that are then easily interpreted as thermal parameters. Similar techniques have been used for the thermal analysis of components such as semiconductor devices [A. R. Hefner and D. L. Blackburn, Thermal Component Models for Electro-Thermal Network Simulation] and analog hardware [X. Huang and H. A. Mantooth, June 2000]. In this paper the P-Spice/spl trade/ program is used as an example; however, the same procedures may be implemented using any electric circuit analysis program.
Keywords
SPICE; networks (circuits); optimisation; thermal analysis; transient analysis; P-Spice program; analog hardware; burst mode type electrical apparatus; cooling system transient analysis; electric circuit transient analysis program; electrical components; high power transmitters; semiconductor devices; thermal circuits; thermal components; transient behavior; Capacitance; Circuit analysis; Coolants; Cooling; Equations; Inductance; Performance analysis; Temperature; Transient analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International
Conference_Location
Dallas, TX, USA
Print_ISBN
0-7803-7915-2
Type
conf
DOI
10.1109/PPC.2003.1277924
Filename
1277924
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