• DocumentCode
    2693845
  • Title

    Multi chip modules for telecom applications

  • Author

    Gustafsson, Kåre ; Flodman, Göran

  • Author_Institution
    Ericsson Telecom, Stockholm, Sweden
  • fYear
    1990
  • fDate
    0-0 1990
  • Firstpage
    43
  • Lastpage
    52
  • Abstract
    It is pointed out that the telecom system performance can be improved by the use of MCM (multichip modules) technology. Better signal transmission properties, lower power dissipation (if CMOS chips are used), and decreased physical volume will be obtained. Today MCM is an expensive technique, but a cost analysis shows that it has the potential of becoming more cost effective than the standard technique of using single-chip packages. It can also become more cost effective to use the MCM technique rather than increase the number of gates on the silicon chip over a certain level. In order to study the properties of the MCM technology, a project has been started at Ericsson Telecom in which a processor application is built up on three different types of MCM substrates.<>
  • Keywords
    hybrid integrated circuits; integrated circuit technology; modules; packaging; printed circuits; project engineering; telecommunication equipment; CMOS chips; Ericsson Telecom; MCM; PCB costs; multichip modules; project; signal transmission properties; telecom system performance; Capacitance; Conductors; Cost function; Delay estimation; Electronics packaging; Power dissipation; Signal design; System performance; Telecommunications; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
  • Conference_Location
    Baveno, Italy
  • Type

    conf

  • DOI
    10.1109/IEMT8.1990.171088
  • Filename
    171088