DocumentCode :
2693864
Title :
Determination of mechanical-thermal deformation in the surface micromachined membrane of gas microsensors
Author :
Dumitrescu, M. ; Cobianu, Cornel ; Pascu, Adrian
Author_Institution :
Inst. of Microtechnol., Bucharest, Romania
Volume :
2
fYear :
2000
fDate :
2000
Firstpage :
463
Abstract :
We performed a simulation study of the “bimetal” effects for the silicon-silicon oxide membrane suspended in different ways. For this purpose, a commercial COSMOS/M program working with finite element method has been used. We investigated the dependence of the value and orientation of the displacements (upward or downward) of the two-layer type membrane as a function of temperature, temperature gradient, geometrical dimensions, expansion coefficients and type of membrane support. The test structure for this simulation consists of a square SiO2/Si membrane of 100×100 μm2 with 10 μm for each layer The connection of the membrane to the bulk silicon was performed as follows: (i) by four horizontal bridges, (ii) by four vertical legs or (iii) by its four edges. From the simulation study, we have obtained the effect of the above variables on the value and orientation of the membrane deformation: (a) the temperature and gradient temperature, layer thickness and rigidity of the material lead to modification of the displacements of the membrane; (b) the type of membrane support leads to modification of the value and orientation of the deformation of the membrane. This study of membrane deformation can be successfully used for designing a new gas structure based on surface micromachining and hopefully with low power consumption and predicted deformation
Keywords :
Young´s modulus; bending; finite element analysis; gas sensors; membranes; micromachining; microsensors; temperature distribution; thermal expansion; thermal stresses; 10 micron; 100 micron; COSMOS/M program; SiO2-Si; Young´s modulus effect; bending; bimetal effects; cantilever; finite element method; gas microsensors; geometrical dimensions; horizontal bridges; low power consumption; mechanical-thermal deformation; membrane displacements; membrane support type; simulation; square SiO2/Si membrane; surface micromachined membrane; suspended membrane; temperature dependence; temperature gradient; thermal expansion coefficients; vertical legs; Biomembranes; Bridges; Deformable models; Finite element methods; Leg; Micromachining; Performance evaluation; Silicon; Temperature dependence; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2000. CAS 2000 Proceedings. International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-5885-6
Type :
conf
DOI :
10.1109/SMICND.2000.889132
Filename :
889132
Link To Document :
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