Title :
SOI materials for MOEMS obtained by silicon direct bonding technique
Author :
Dunare, Camelia ; Cernica, Ileanil ; Popescu, Dan ; Popescu, Adrian ; Cristea, Iuna ; Modreanu, Mircea ; Manea, Elena
Author_Institution :
Inst. of Microtechnol., Bucharest, Romania
Abstract :
In this paper we propose a new technology to obtain SOI (silicon-on-insulator) substrates. This new technology is based on silicon direct bonding techniques using hydrophilic surfaces. The obtained substrates can be used in MOEMS for ingression of light sources. This method is high versatile and provides a high degree flexibility in materials integration
Keywords :
micro-optics; silicon-on-insulator; wafer bonding; MOEMS; SOI substrate; Si; hydrophilic surface; light source; materials integration; silicon direct bonding; Annealing; Atomic measurements; Conductivity; Dielectric substrates; Energy measurement; Oxidation; Silicon; Surface cracks; Temperature; Wafer bonding;
Conference_Titel :
Semiconductor Conference, 2000. CAS 2000 Proceedings. International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-5885-6
DOI :
10.1109/SMICND.2000.889149
