DocumentCode
2694144
Title
SOI materials for MOEMS obtained by silicon direct bonding technique
Author
Dunare, Camelia ; Cernica, Ileanil ; Popescu, Dan ; Popescu, Adrian ; Cristea, Iuna ; Modreanu, Mircea ; Manea, Elena
Author_Institution
Inst. of Microtechnol., Bucharest, Romania
Volume
2
fYear
2000
fDate
2000
Firstpage
531
Abstract
In this paper we propose a new technology to obtain SOI (silicon-on-insulator) substrates. This new technology is based on silicon direct bonding techniques using hydrophilic surfaces. The obtained substrates can be used in MOEMS for ingression of light sources. This method is high versatile and provides a high degree flexibility in materials integration
Keywords
micro-optics; silicon-on-insulator; wafer bonding; MOEMS; SOI substrate; Si; hydrophilic surface; light source; materials integration; silicon direct bonding; Annealing; Atomic measurements; Conductivity; Dielectric substrates; Energy measurement; Oxidation; Silicon; Surface cracks; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2000. CAS 2000 Proceedings. International
Conference_Location
Sinaia
Print_ISBN
0-7803-5885-6
Type
conf
DOI
10.1109/SMICND.2000.889149
Filename
889149
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