Title :
Some hybrid technologies comparison in the manufacturing of multi-chip modules for space application
Author :
Di Marcantonio, U. ; Cirone, R.
Author_Institution :
Selenia Spazio, L´´Aquila, Italy
Abstract :
A multichip-module (MCM) hybrid has been manufactured by several technological approaches for space applications. Results of investigations into some technology alternatives to thick-film multilayer technology are presented. In particular, thin-film multilayer technologies using polyimides or SiO/sub 2/ as dielectric have been evaluated, multilayer thin-film technology and low-temperature cofired ceramic multilayer technology allow higher interconnection density and high-speed applications. It has been demonstrated, by an MCM reference hybrid, that modules manufactured by these technologies have at least the same performance as the thick-film version, and allow savings of room and mass.<>
Keywords :
hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; modules; packaging; thin film circuits; SiO/sub 2/; high-speed applications; hybrid technologies; interconnection density; low-temperature cofired ceramic multilayer technology; multi-chip modules; polyimides; space application; thin-film multilayer technologies; Decoding; Dielectric substrates; Dielectric thin films; Manufacturing; Nonhomogeneous media; Packaging; Polyimides; Space technology; Sputtering; Temperature;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171090
