The selection of materials in the development of high density multichip interconnect (HDMI) circuits

High-density multichip interconnect (HDMI) refers to a technique which involves multilayering and patterning thin films of conductor metals and low-dielectric-constant polymers on a base substrate of silicon or alumina. These circuits constitute an advanced form and next generation of hybrid microcircuits. Additional benefits derived from the techniques used for achieving high-speed performance are in miniaturization, cost reduction, and increased payload capability. Such substrates can also change the boundaries of design. By providing a low-overhead substrate for naked chips, a design can be partitioned into smaller blocks with consequent improvements in chip yield. The HDMI technology is described, and details of assembly and module packaging are provided.<>