Title :
Silicon micromachined ultrasonic transducer with improved power transfer for cutting applications
Author :
Friedrich, Felice ; Lockhart, Robert ; Briand, Danick ; Isarakorn, Don ; Margairaz, Philippe ; Sandoz, Jean-Paul ; Brossard, Jerome ; Keppner, Herbert ; Olson, William ; Dietz, Thomas ; de Rooij, Nico F. ; Burger, John Robert
Author_Institution :
Inst. of Microeng. (IMT), Ecole Polytech. Fed. de Lausanne (EPFL), Neuchatel, Switzerland
Abstract :
This work presents a light and powerful silicon based ultrasonic micro-cutter. In order to achieve high cutting efficiency as well as good controllability when driven by commercially available control systems, important design parameters haven been identified. They have been verified by FEM-simulation as well as experiments via laser Doppler vibrometer measurements and cutting tests. The samples have been manufactured cost-effectively by microfabrication batch processing and their cutting ability has been successfully demonstrated on chicken tissue, while driven in a typical frequency range from 50 kHz to 100 kHz, generating tip displacements up to 36 μmpp.
Keywords :
Doppler measurement; biological tissues; biomedical transducers; biomedical ultrasonics; controllability; cutting; finite element analysis; laser applications in medicine; medical control systems; microfabrication; micromachining; silicon; ultrasonic transducers; vibration measurement; FEM simulation; Si; chicken tissue; commercially available control systems; cutting applications; cutting testing; design parameters; frequency 50 kHz to 100 kHz; generating tip displacements; high-cutting efficiency; laser Doppler vibrometer measurements; microfabrication batch processing; power transfer; silicon based ultrasonic microcutter; silicon micromachined ultrasonic transducer; Acoustics; Actuators; Damping; Displacement measurement; Resonant frequency; Silicon; Surgery; high power acoustic transducer; micromachined acoustic horn; piezoelectric; silicon; ultrasonic cutter; ultrasonic scalpel;
Conference_Titel :
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location :
Dresden
Print_ISBN :
978-1-4673-4561-3
DOI :
10.1109/ULTSYM.2012.0291