DocumentCode
2694978
Title
Design of a versatile die placement system
Author
Rochat, D. ; Peguiron, S.
Author_Institution
Valtronic SA, Les Charbonnieres, Switzerland
fYear
1990
fDate
0-0 1990
Firstpage
114
Lastpage
119
Abstract
The design of the versatile die placement system at Valtronic is described. The application of bare integrated circuits to a substrate (die attach) is one of the main operations of the technology. The modules produced by Valtronic (up to 40 different modules a month) can carry up to 20 different dice per substrate. Valtronic has a dedicated machine for its production which allows it to adapt to each product by using the best-suited form of die presentation while offering the ideal compromise between the automation required for the short and medium substrate runs.<>
Keywords
hybrid integrated circuits; integrated circuit manufacture; microassembling; modules; Valtronic; automation; bare integrated circuits; bonding; die attach; die placement system; hybrid circuit modules; Bonding; Conducting materials; Electronics industry; Glass; Heat sinks; Industrial electronics; Integrated circuit technology; Microassembly; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location
Baveno, Italy
Type
conf
DOI
10.1109/IEMT8.1990.171095
Filename
171095
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