DocumentCode :
2694979
Title :
Piezoelectric and electroacoustic properties of Ti-doped AlN thin films as a function of Ti content
Author :
Iborra, E. ; Capilla, J. ; Olivares, J. ; Clement, M. ; Felmetsger, V.
Author_Institution :
GMME-CEMDATIC-ETSIT, Univ. Politec. de Madrid, Madrid, Spain
fYear :
2012
fDate :
7-10 Oct. 2012
Firstpage :
2734
Lastpage :
2737
Abstract :
In this work we present the assessment of the structural and piezoelectric properties of Al(0.5-x)TixN0.5 compounds (titanium content <;6% atomic), which are expected to possess improved properties than conventional AlN films, such as larger piezoelectric activity, thermal stability of frequency and temperature resistance. Al:Ti:N films were deposited from a twin concentric target of Al and Ti by reactive AC sputtering, which provided films with a radial gradient of the Ti concentration. The properties of the films were investigated as a function of their composition, which was measured by electron dispersive energy dispersive X-ray spectroscopy and Rutherford backscattering spectrometry. The microstructure and morphology of the films were assessed by X-ray diffraction and infrared reflectance. Their electroacoustic properties and dielectric constant were derived from the frequency response of BAW test resonators. Al:Ti:N films properties appear to be strongly dependent on the Ti content, which modifies the AlN wurtzite crystal structure leading to greater dielectric constant, lower sound velocities, lower electromechanical factor and moderately improved temperature coefficient of the resonant frequency.
Keywords :
III-V semiconductors; Rutherford backscattering; X-ray chemical analysis; X-ray diffraction; acoustic wave velocity; acoustoelectric effects; aluminium compounds; crystal microstructure; electromechanical effects; infrared spectra; permittivity; piezoelectric semiconductors; piezoelectric thin films; semiconductor growth; semiconductor thin films; sputter deposition; thermal stability; titanium compounds; wide band gap semiconductors; Al(0.5-x)TixN0.5; Rutherford backscattering spectrometry; X-ray diffraction; dielectric constant; electroacoustic properties; electromechanical factor; electron dispersive energy dispersive X-ray spectroscopy; frequency response; infrared reflectance; microstructure; morphology; piezoelectric properties; radial gradient; reactive AC sputtering; resonant frequency; sound velocity; structural properties; temperature coefficient; temperature resistance; thermal stability; thin films; wurtzite crystal structure; Acoustics; Dielectric constant; Films; III-V semiconductor materials; Metals; Resonant frequency; Sputtering; AlN doped; AlTiN; BAW; Electroacoustic devices; Piezoelctric; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location :
Dresden
ISSN :
1948-5719
Print_ISBN :
978-1-4673-4561-3
Type :
conf
DOI :
10.1109/ULTSYM.2012.0685
Filename :
6562433
Link To Document :
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