Special capabilities of an optimized contact/proximity aligner for applications using DuPont Riston

Author

Reyerse, Costant

fYear

1990

fDate

0-0 1990

Firstpage

147

Lastpage

153

Abstract

The author describes the essential elements of a mask aligner configured to meet the demands of the high-density microinterconnect (HDMI) market. Emphasis is placed on the specific requirements of DuPont Riston when used with multichip module substrates. Issues specific to use of Dupont Riston on typical HDMI substrates, as well as the specifications of the exposure tool, are addressed. A formula is presented which is used as a basis for optimizing the mask aligner to provide a complete aligner that will address the issues unique to HDMI. Factors considered are method of exposure, available intensity, method of handling, and optics.<>

Keywords

integrated circuit manufacture; modules; packaging; position control; DuPont Riston; HDMI substrates; exposure tool; high density microinterconnect; intensity; mask aligner; method of exposure; method of handling; multichip module substrates; optics; optimized contact/proximity aligner; Ceramics; Conducting materials; Copper; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Silicon; Substrates; Thermal conductivity; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International

Conference_Location

Baveno, Italy

Type

conf

DOI

10.1109/IEMT8.1990.171099

Filename

171099