Title :
3 kW in 60% less space: design of high power density telecommunications rectifiers with improved reliability
Author_Institution :
Eaton Powerware, Christchurch, New Zealand
Abstract :
Due to increase in the floor space cost, rectifiers and other telecommunication gear, are getting smaller. Designing smaller rectifiers is not a simple task. Several design criteria must be simultaneously satisfied. These include creepages and clearances, EMC, thermal design, effects of fan forced cooling on reliability, cost and use of industry standard components. This paper discusses design challenges in the area of thermal design, and robustness to dust and airborne contaminants which can often be corrosive. Finally, it shows a practical application of these design techniques into a high reliability 3 kW telecommunications rectifier with a power density exceeding 10 W/in3.
Keywords :
contamination; cooling; corrosion; electromagnetic compatibility; fans; rectifying circuits; telecommunication network reliability; telecommunication power supplies; 3 kW; EMC; airborne contaminants; clearances; corrosion; creepages; dust contaminants; fan forced cooling; industry standard components; power density; reliability; robustness; telecommunication gear; telecommunications rectifiers; thermal design; Circuits; Computational fluid dynamics; Cooling; Costs; Power supplies; Power system analysis computing; Power system simulation; Rectifiers; Robustness; Thermal force;
Conference_Titel :
Telecommunications Energy Conference, 2004. INTELEC 2004. 26th Annual International
Print_ISBN :
0-7803-8458-X
DOI :
10.1109/INTLEC.2004.1401496