Title :
Advanced packaging technologies-an overview
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
The advanced packaging technologies that can be expected in high-performance systems in the 1990s are discussed in terms of chip connection, power distribution, heat removal, thick- and thin-film wiring, and package interconnections. Some logical trends in each of the major packaging technologies are projected, including chip-level connection providing the required connections between the chip and the package; power distribution to the chip and heat removal from the chip; first-level packages providing all the necessary wiring, interconnections, and power distribution; first-to-second-level interconnections; and second-level packages providing all the necessary wiring, connections, power distribution, and power supply connection. Optical interconnections are also discussed.<>
Keywords :
integrated circuit technology; optical interconnections; packaging; reviews; chip connection; first-level packages; first-to-second-level interconnections; heat removal; high-performance systems; optical interconnections; overview; package interconnections; packaging technologies; power distribution; second-level packages; thick film wiring; thin-film wiring; Acceleration; Costs; High performance computing; Integrated circuit interconnections; Material storage; Packaging machines; Power distribution; Semiconductor device packaging; Semiconductor materials; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
DOI :
10.1109/IEMT8.1990.171100
