• DocumentCode
    2695933
  • Title

    Effect of temperature on isothermal fatigue of solders

  • Author

    Vaynman, Semyon

  • Author_Institution
    BIRL, Northwestern Univ., Evanston, IL, USA
  • fYear
    1990
  • fDate
    23-25 May 1990
  • Firstpage
    16
  • Lastpage
    20
  • Abstract
    The effect of temperature on isothermal fatigue of low-tin lead-based and lead-tin eutectic solders was studied at low strain ranges (0.3-1.0% total strain) in tests without and with hold time in the cycle. While temperature almost does not affect the fatigue life of eutectic solder, the fatigue life of low-tin lead-based solder is a complex function of temperature. Extrapolation of fatigue data for this solder was possible only in a 25 to 80°C temperature range using the values of apparent activation energy from 25 to 45 kJ/mol. depending on strain range, strain rate, and presence of hold time in the cycle. Variation in the values of activation energy was found to be associated with different failure modes under various testing conditions. The higher activation energy for fatigue of low-tin lead-based solder was associated with the mixed transgranular-intergranular mode of failure. Failure in grain boundaries was characterized by lower values of activation energy
  • Keywords
    fatigue testing; lead alloys; soldering; tin alloys; 25 to 80 C; Sn-Pb alloy solders; activation energy; effect of temperature; eutectic solders; failure modes; fatigue data extrapolation; fatigue life; hold time; isothermal fatigue of solders; low Sn Pb based solder; low strain ranges; mixed transgranular-intergranular mode of failure; presence of hold time; strain range; strain rate; temperature range; testing conditions; Capacitive sensors; Electronic packaging thermal management; Fatigue; Isothermal processes; Joining materials; Lead; Temperature distribution; Tensile strain; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ITHERM.1990.113306
  • Filename
    113306