• DocumentCode
    2695986
  • Title

    Nonlinear acoustic pulse evolution at solid wedges

  • Author

    Sokolova, Elena S. ; Pupyrev, Pavel D. ; Lomonosov, Alexey M. ; Mayer, Andreas P. ; Hess, P. ; Kovalev, Alexander S.

  • Author_Institution
    B.Verkin Inst. for Low Temp. Phys. & Eng., Kharkov, Ukraine
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    515
  • Lastpage
    518
  • Abstract
    The evolution of the shape of high-intensity acoustic pulses at the apex of an anisotropic elastic wedge is described by an evolution equation which contains an effective nonlinearity of second order, if the symmetry of the geometry is sufficiently low. The strength of this nonlinearity is governed by a kernel function. For silicon as a strongly anisotropic wedge material, this kernel function has been computed from the second-order and third-order elastic moduli for various wedge angles and orientations of the surfaces of the wedge. On the basis of the nonlinear evolution equation with kernel functions corresponding to rectangular wedges made of silicon, numerical simulations have been carried out for the propagation of acoustic pulses with intensities achievable in laser-ultrasonic experiments. Spiking and shock formation are found which are strongly geometry-dependent, reflecting strong effects of anisotropy.
  • Keywords
    elastic moduli; elemental semiconductors; nonlinear acoustics; nonlinear equations; numerical analysis; shapes (structures); shock waves; silicon; structural acoustics; ultrasonic propagation; Si; acoustic pulse propagation; anisotropic elastic wedge; anisotropic wedge material; geometry symmetry; geometry-dependence; high-intensity acoustic pulse shape; kernel function; laser-ultrasonic experiments; nonlinear acoustic pulse; nonlinear evolution equation; numerical simulations; rectangular wedges; second order nonlinearity; second-order elastic moduli; shock formation; silicon; solid wedges; spiking; surface orientations; third-order elastic moduli; wedge angles; Equations; Kernel; Mathematical model; Silicon; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0128
  • Filename
    6562487