Title :
Thermal stress analysis of plastic leaded chip carriers
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
The thermal stresses of molded plastic chip carriers (MPCCs) such as the plastic quad flat pack (PQFD) and plastic leaded chip carriers (PLCCs) are studied using the finite-element method. Two different types of lead frame materials are considered, alloy-42 and copper. The predicted failure mechanism agrees well with experimental data. In addition, a dual-inline package (DIP) with two different molded plastics is analyzed, and the stress results obtained by the finite-element method are found to be in excellent agreement with the experimental results. The results presented provide a better understanding of the thermal behavior of molded plastic packages and demonstrate the feasibility of using the finite-element method to design such electronic packaging
Keywords :
failure analysis; integrated circuit technology; packaging; reliability; thermal stresses; Cu lead frame; DIP; MPCCs; PLCCs; PQFD; alloy-42; dual-inline package; experimental data; experimental results; finite-element method; lead frame materials; molded plastic chip carriers; molded plastic packages; molded plastics; plastic leaded chip carriers; plastic quad flat pack; predicted failure mechanism; thermal stress analysis; Electronic packaging thermal management; Electronics packaging; Finite element methods; Lead; Plastic packaging; Space heating; Thermal conductivity; Thermal expansion; Thermal force; Thermal stresses;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ITHERM.1990.113311
