Low temperature die attach material

A novel silver lead phosphovanadate glass die attach material is discussed. Its sintering characteristics are examined by dilatometry, and the organic system is examined by thermogravimetric analysis. Sintering is found to occur at a lower temperature than with conventional silver-glass systems. This is caused by reaction between the silver and one of the glass components during heat treatment. The vehicle is found to evaporate faster, allowing void-free processing for large-area dice. A large-area die can be processed in a single step. This can save hours of processing time, improving throughput and yields of the heat-sensitive, fine-line geometries now coming into routine use.<>